Mechanism for forming filled wafers.



E. E. LAWRENCE. MECHANISM FOR FORMING FILLED WAFEBS.

APPLICATION FILED IAN.25, 1912.

Patented Jan.25,1916.

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E. E. LAWRENCE. MECHANISM FOR FORMING FILLED WAFERS.

APPLICATION FILED JAN.25,1912.

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THE COLUMBIA PLANOGRAPH (10., WASHINGTON, D. c.

E. E. LAWRENCE.

MECHANISM FOR FORMING FILLED WAFERS. IAPPLICATLON FILED JAN.25, L912. 1,169,546. Patented Jan. 25, 1916.

8 SHEETS-SHEET 3.

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MECHANISM FOR FORMING FILLED WAFERS.

APPHCATION FILED JAN-25, i912.

Patented Jan. 25, 1916.

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Edwa rd ELawr'sme Mira/ass es .fliys,

THE Coumnm pumocmpu co, WASHINGTON, u. c.

E E. LAWRENCE.

MECHANISM FOR FORMING FIL LED WAFERS.

APPLICATION FILED .IAN.25, I912.

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UMBlA PLANDGRAPH c0 WASHINa'rcN D c E. E. LAWRENCE. MECHANISM FOR. FORMING FILLED WAFERS. APPLICATION FILED JAN.25, I912.

1,169,546. Patented Jan.25, 1916.

8 SHEETS-SHEET 6.

THE COLUMBIA PLArjOGRAPI-I (10.. WAsHING'roN. n. c.

E. E. LAWRENCE.

MECHANISM FOR FORMING FILLED WAFERS APPITICATION FILED JAN.25, 1912.

1 159 546, Patented Jan. 25, 1916.

8 SHEETSSHEET 7.

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E. E. LAWRENCE.

MECHANISM FOR FORMING FILLED WAFERS.

APPLICATION FILED JAN. 25,1912- g @Q L 1 J w LT @Qrd flkiimesQse-s mavemar:

Edwawdfillawmnve y @9074, M WM zfi THE COLUMBIA PLANOGRAPH c0., WASHINGTON. D. c.

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BISCUIT C612 ANY, fil KANSAS CITY,

:l ArTEN l @ldliitllh MECHANISM :FQE FORMING FILLED WAFER-.5.

Specification of Letters Patent.

Patented Jan. 25 il ilfi.

Application filed January 25, 1512. Serial No. 873,355.

Law- .tes, and county or husctts, have specification. representing in order od, 1 have disz'ment thereof in the rings, wherein 's a plan view of one form of d ing my invention and for b out my process; '2 is a front thereof" lig. 3 is a side elevation i l is a plan view on an enlarged portion the mechanism shown and representing also a portion of sheets Fig 5 is vertical longion of a portion of the appar us: 3 is a transverse section taken rld 1 7' a 1 H 1. I L i 'wilgi a portion oi one apparatus, Jig. t

is a

")lan riew of the mold wherein the 30 wafer sheets may be formed, and showing s is open; Fig. 8 is a plan view of a the complete wai er sheet before 7, Fig. 9 is a transverse section 11 theretlnrcugh; is a plan view t another form of filled waf r; plan w of the other sheet s a transverse section taken ts and the filling; 13 r form of apparatus cmbodpung; my inven and for practising my method; Fig. i iis a longitudinal section of such form of apparatus; 15 is a M thereofg.

transverse section iil tl'iOf tail-zen. through the 1 tail said form of diagrz'annatic view eons severance of ito ultimate pieces; transverse section taken 'er sheets and the sile articles of food have .ieretotore customaril been "formed by preparing wafer sheets in suitable molds and applying the filling to one 0" them by a aalette lmite, which is manually drawn across the entire surface thereof when positioned upon a slab or other suitable support, after whiclthe other wafer sheet is superimposed thereon. Not only is the filling necessarily applied to the entire surface of the sheet, but a considerable proportion thereof wasted because spread onto the adjacei b surrounding portions of the slab or other support.

Moreover it is impossible in this manner of application to apply the filling evenly to the sheet, and without either a deficiency or an excess of material. After the covering wafer sheet has been superimposed upon the filling, the sheets are subdivided into individual pieces. lot only is there considerable loss of filling that is not confined to the wafer sheet, but is spread onto the support, but there is also the loss of that portion of the filling applied to those parts of the wafer sheet that are between the ultimate or segregated wafers. Particularly is this true when the wafer sheets are molded into spaced concavities in the formation of artificial nuts or similar articles which are ultimately severed close to the concavities with the consequent loss 01" the flat or connecting portion of the wafer sheets. iVhen a sheet has been molded into spaced concavities for the formation of artificial nuts or the like, it is a matter of exceeding diiiiculty to apply the filling thereto without crushing a considerable percentage of the concavities or breaking the connecting portions of the Wafer sheet, thus, ruining the entire sheet. Furthermore there is a very substantial loss in the breakins; of the wafer sheets not only in the manapplication of the filling thereto, but I in the cutting of the sheets into strips and into ul imate individual pieces.

In accordance with my invention, 1 mold the sheets into suitable form, which may be made by forming spaced concavities therein, after wnich the sleet is applied to a suppo ting plate having openings or concavities the; in corresponding in shape and position to the concavities of the wafer sheet, if the latter be so molded. i then superimpose upon the waiter sheet die or stencil plate having openings corresponding in position and size to the segregated area to which only the filling is to be applied. Thereupon I apply the filling preferably by relatively reciprocating the supporting mold plate, the

wafer sheet and he stencil or die plate with 'iect to the l i plate is removed, filled wafer sheet anotier filled wafer sheet the led areas thereof into cer to prevent breaking cavities or other formations do'not contain filling and that therefore here is not only no loss of filling, but that the said severed portions of he wafer sheets may themselves be employed in other processes of manufacture, that is to say, in the formation of other products.

Referring mor part cularly to the ('ra\ ings and first to Figs. 1 to 6 inclusive, I Lave therein represented a su table 'rame i supporting table or Md 1, upon which 's mounted a skeleton 1 nine 2, l

1. cated in Fig. 5, acautec receive upon the shouldered face 3 th reef a suitable sup porting mold plate 4- which, in accordance with one embodiment of my invention, is provided with openings The supporting mold plate is provided with openings when the wafer sheet is molded into spaced concavities, in order that the said concavities may enter said openings and the sheet be supported by the connecting flat portions of the sheet resting flatwise against the plate 41 between the openings 5 therein. While the plate 4: may be continuous hroughout, 1 preferably form the same in two sections A, B, clearly indicated in Fig. 4, and mount them upon parallel rods 6, 6, which are supported upon the shouldered portion 3 of the frame 2, so as to permit the two sections A, B of the plate lto be swung upwardly to bring the wafer sneets into contact, as indicated in dotted lines in Fig. 6, The wafer 7 sheets, which are composed of any usual inaterial and which is generally thin and fragile, are formed by applying the dough to a mold, such as indicated at 7, 8 in F 7, wherein 1 have represented two members of a mold provided with concavities 9 and en tering projections 10 to mold the dough or wafer sheet 11 therebetween into the desired shape. 1 have herein chosen to disclose as preferred embodiment of the invention the molding of a wafer sheet with spaced concavit-ies, to form nut sections, customarily known when completed as almonds or philopenas. After the wafer sheets have been After the filling has sheets in the separation thereof into ncividual pieces, 1 preferably bottom 20 molded, 1 then apply two wafer sheets 12, 13 to the mold supporting plates A, B,.as indicated most clearly in Fig. 4-, after which 1 superimpose upon the wafer sheets a die or stencil plate 1 1 provided with openings i l corresponding in size and position to the concavities of the wafer sheets. The said die or stencil plate 14 may be a continuous sheet overlying both wafer sheets12, 13. This die or stencil plate may be of any suitable material, but is preferably of copper, and in certain embodiments of mvinvention, as, for example, that disclosed 1 to 6 inclusive, is made as thin as possible so that the amount, of filling applied to t concavities 15 of the wafer sheets m trude' beyond the level of the wafer to a minimum extent, but neverthele ciently to insure the binding toget er wafer sheets by the meeting pr surfaces of the filling when two wafzr sliee are brought into coincidence. 1n 0 her forms of my invention, however, and particularly those wherein the wafer eet is not molded into well defined cone-a its, the

stencil plate is customarily thicker, so as to secure the application of thicker layers of filling thereto.

As shown most clearly in Fig. 5, the die or stencil plate 14 is wrapped or otherwise secured at its rear end 16 about a transverse bar or rod 1'? supported upon the frame and provided at its ends with rods 18 supported upon the frame and adapted to be swung upwardly as indicated in Fig. 3, so as to lift the die or stencil plate off the wafer sheets after the latter have had the filling applied thereto. In order to apply the filling to the wafer sheet or sheets, 1 preferably provide a hopper 19 indicated most clearly in Figs. 1 and 5, wherein it is shown as of boxlike form having an open bottom 20 with preferably inclined lower walls 21. When the mechanism is not in operation, the hopper is supported at the rear of the die or stencil plate upon an imperforate plate 22, which is itself supported upon the portion 23 of the frame. Preferably 1 provide the lower face of the hopper with longitudinally extending wipers 2% of felt or oth r suitable material to insure the proper application of the filling to the openings of the stencil plate 14. The hopper 19 is provided with a suitable shaft 25, whereon is fast one or it may be a pluralitr of rotatable stirrers or mixer blades 26, which serve to enforce the discharge of the filling through the open during the relative reciprocation of the hopper and the wafer sheet or sheets.

In the form of the invention shown in Figs. 1 to 6 hopper as movable to and fro over the die or stencil 14. While any suitable means maybe employee to efiect this result, 1 have erem represented the framing as having inclusive, 1 have represented the zontal way suitably supported upon coiled spring or other yielding supports 31 and along which the hopper 19 travels back and forth across the die or stencil plate 14, upon rotation of the shaft 25. It will be obvious that in the to and fro reciprocation of the hopper 19, the filling is discharged only through the openings 14: of the stencil plate and that the filling is discharged in such measured or predetermined quantities that the filling also extends from the base of the concavities to the upper face of the die or stencil plate 14, so that it protrudes beyond the level of the mouth of the COIICtl'v'ltlQS to an extent dependent upon the thickness of the die or stencil plate. In this manner, I secure a predetermined slight excess of filling material which when two wafer sheets are brought into coincidence compels the binding or sealing together of the wafer sheets thereby.

In former processes, so far as I am aware, either the filling material was supplied in such deficiency that it did not extend to or beyond the level of the wafer sheet, and thus did not effect the sealing or binding of wafer sheets together, or it was applied in such excess that there was a great loss of filling material between the concavities and also the improper union of the wafer sheets.

In former processes so far as I am aware it was customary merely to support the molded wafer sheet upon an open slab and to spread the filling thereon by a knife or blade. If during the molding or prior to the application of the filling the wafer sheet were broken, it was substantially impossible touse the broken sheet not only for the reason that the sheet could not be positioned to receive the filling, but because the broken sheet could not be so positioned that after the filling, another sheet having corresponding concavities could be superimposed thereon into coincidence. This resulted in the loss of allbroken sheets. In the practice of my invention, however, in accordance with which the wafer sheets are positioned upon the mold plate or plates and are afterward covered with a stencil plate, it is an easy matter to use broken portions of wafer sheets by fitting them onto the mold plates A, B with their concavities resting in the openings 5 thereof, it being immaterial that flat portions of the wafer sheets overlie. It is a usual custom, in the practice of my invention, for the workman to keep a supply of broken sheets from which he may quickly select a piece to patch out a wafer sheet from which he has been compelled to break off a damaged portion. In this manner substantially all loss of broken wafer sheets is eliminated, and further than this the broken pieces are always correctly positioned with respect to the sheet that is to be superimposed thereon, because all portions of both sheets are correctly positioned by reason of the openings 5 in the supporting mold plate a.

After the filling has been applied to the wafer sheets and the hopper 19 has been returned to its inoperative position, the die or stencil plate 14 is swung into elevated position, as indicated in dotted lines at 82 in Fig. 5, and thereupon the two sections A, B of the mold plate are swung into elevated position, as indicated at 83, in 6, so as to bring the wafer sections together with the segregated filling areas in coincidence.

In Figs. 8 and 9, I have represented in plan and cross section a portion of superimposed filled wafer sheets, wherein at 34; is represented the upper wafer sheet and at 35 the lower wafer sheet, and at 36 the filling which serves to bind or seal the wafer sheets together. The connecting or flat portions 37 of the wafer sheets are devoid of filling, as indicated, so that all less of filling between the co-ncavities is wholly eliminated. After the filled wafer sheets have been brought into register or coincidence as described, or in any other suitable manner, I remove the filled and adhering wafer sheets to a suitable severing mechanism shown diagrammatically in Figs. 17 and 18 and having a gang of knives 38 which are operated simultaneously so as to cut the filled wafer sheets 39 simultaneously into individual or ultimate pieces and avoid that breakage of pieces of wafer sections that necessarily occurs when the filled sheets are first severed into strips and then afterward cut transversely into ultimate pieces. In order to prevent the slipping of the two sections of each completed piece upon each other, I harden the filling by cooling the ultimate pieces or the filled sheets. Preferably I cool the individual piece after severance in any suitable manner.

Instead of molding or embossing the wafer sheets as described, I may employ wholly fiat sheets to make, mark or form them in any suitable manner for the reception of the filling. In Fig. 10 I have represented one face of a wafer sheet having ridges or other substantially rectangular markings 41 thereon, and in Fig. 11 a second sheet ll having its face provided with small diagonally arrange-d pockets or shallow recesses 42. If desired, each sheet may have one face formed as shown in Fig. 10 and the opposite face as shown in Fig. 11,

or they may be formed or marked in any other suitable manner. These sheets are superimposed one upon the other as indicated Fig. 12 .after the filling 13 has been applied thereto in the .manner already indicated, and then the filled sheets are severed by a gang of simultaneously operating knives in the manner already described.

In applying filling to a sheet, such as shown in Fig. 10 or Fig. 11, in accordance with the former method of procedure, the filling has been applied necessarily not only within the boundaries of the rectangular markings or formations 41, and to the narrow longitudinal and cross areas 44:, but also to the surrounding areas 45, and in fact to the surrounding portions of the slab or sup port, as already set forth. When the filled sheets are severed by the gang of knives, to which 1 have referred, there is customarily out out by the knives strips or pieces of ma terial corresponding to the areas 414C, 15. In the old method of procedure, these discarded areas were coated with filling, which was therefore necessarily lost. In accordance with my present invention, however, the stencil or die plate is provided with openings corresponding in position and size to the areas bounded by the markings or formations 1-1, and hence the filling is applied only within said boundaries in segregated areas, and no filling is lost when the filled sheets are severed.

Inl igs, 13, 1 1, 15 and 16 I have repre sented a modified form of apparatus for practising my invention. Therein the hopper 46 is stationarily mounted upon the frame, being secured by bolts and wing nuts 46 to angle'brackets 46 secured to the side members of the frame, as indicated in Figs. 13 and 15, and is provided if desired with a stirrer or blade such as shown in Fig. 1. The framing 4:7 is provided with suitable ways whereon to reciprocate the wafer supporting plate together with the wafer sheets and stencil plate. Herein for the purpose I have represented the framing as provided with opposite shoulders or ways 48 whereon are mounted suitable tracks 19 having ball bearings 50 directly supporting the side bars 51, which at their under faces may if desired have inset therein metallic strips 52 with which the ball bearings 50 directly engage. Any suitable number of ball bearings may be provided for the purpose, or any other suitable supporting and guiding device may be substituted therefor. To the side bars 51 connected channel bar 51 and also at their ends, 1 secure a wafer sheet supporting plate 53 which may be perforated or otherwise formed to support embossed or similar wafer sheets as described with respect to the preceding form of my invention, but which is herein shown as solid to support a wafer sheet of the general character shown in Fig.

10 or Fig. 11 normally underlyin the hopper 46 in an imperforate'plate 53' also supported upon said'side bars 51. To-the side bars 51 or to the supporting plate 53., 1 secure by side strips 54 a push bar 55' by means of which the supporting plate 53 and the plate 53 may be slid back and forth beneath the hopper, so as to permit the discharge of the filling upon the upper face of the wafer sheet. 1 preferably provide the" plate 53 with side strips 55 to engage rubber or other cushions 55 upon theframe. Upon the upper face of the wafer sheet 1 position the die or stencil plate 56 preferably hinged by tapered screws 56 in the side bars 51 taking into the cross piece 56 thereof. 7 Preferably, in this form of my invention, the die or stencil plate is of asingle piece, and after the wafer sheet positioned upon the supporting plate 53 has had segregated filling areas applied thereto and after the stencil plate 56 has been swung into elevated position in the. manner previously described,

a second sheet is superimposed thereon. This can readily be effected, because the second sheet is of the same size filled sheet, and as its markings or formations need not correspond tothose of the filled sheet, there is no necessity to make it register absolutely therewith. The openings 57 of the die or stencil plate 56 cor-V respond in size and position to the outlines 41 of the wafer heet to be filled,'so that the filling is applied only within the confines of such area. Therefore in toe cutting of the filled sheets after superposition of one upon the other, there is no loss of filling be tween the blades. The thickness of the filling that is to be applied to a substantially fiat or non-embossed wafer sheet is the thickness of the die or stencil plate 56, which therefore is generally thicker than that employed in connection with the form of my invention shown in Figs. 1 to 6 inclusive.

It will be evident from the foregoing description thatthe filling may be applied at much greater speed than heretofore, and in measured predetermined quantities, so that neither an excess or deficiency in amount results, and furthermore the wafer sheets are protected while the filling is being applied thereto. A. further and more important saving, however, is effected, because of the application of the filling to segregated areas only, so that when the sheets are severed into the ultimate pieces, no filling whatever is lost. Furthermore, owing to the fact that it is possible to use broken pieces of wafer sheets, a very large saving is thereby effected.

It will, of course, lie-evident that certain 5 steps of the herein disclosed process may be carried out by hand, as for example, the depositing of the filling material in spaced areas. The molding of the wafer sheets may be efiected in any suitable manner, and the and shape as thepreferably simultaneous severing of the filled sheets into ultimate pieces may be carried out in any desired manner. The supporting sheet a, or its substitute, may if desired be formed in a single piece, and after the Water sheet supported thereon has been filled, another Water sheet, either filled or unfilled, may be superimposed thereon in any suitable manner. *Whether or not both water sheets are individually supplied With filling Will depend generally upon the shape and confi uration of the wafer sheets. l v here, as in that form of my invention disclosed in Figs. 1 to 6 inclusive, the filled Wafers are of the form of nuts or similar articles, I a e'terably apply the filling to both sheets and then superimpose one sheet upon the other in any desired manner.

Having thus described one illustrative embodiment of my invention and the best manner of carrying the same into eliect, ll desire it to be understood that although specific terms are employed, they are used in a generic and descriptive sense and not for purposes of limitation, the scope of the inven tion being set forth in the following claims:

1. lilechanism for forming filled Wafers comprising in combination, a Water sheet supporting plate having sections relatively movable into a face to face relation, a die or stencil plate mounted to be superposed thereon, and means for supplying filling through said die or stencil plate to the Water sheet upon the supporting plate.

Mechanism for forming filled Wafers comprising in combination, a Wafer sheet supporting plate havin spaced concavities, a die or stencil plate adapted to be superposed upon said supporting plate, and means for supplying filling through said die or stencil plate to the said concavities of Water sheet upon the supporting plate.

3. Mechanism for forming filled Wafers comprising in combination, means to receive a pair of matching Wafer sheets, a die or stencil plate adapted to be superposed upon said means, means for supplying filling through said die or stencil plate to said Water sheets, and means to superimpose one of said sheets upon the other.

Mechanism for forming filled Wafers comprising in combination, a Wafer supporting plate having a pairof members shaped to receive matching Wafer sheets, a die or stencil plate adapted to be superimposed upon said plate, and means for supplying filling through said die or stencil plate to the Wafer sheet upon said supportin plate.

5. Mechanism for forming filled Wafers comprising, in combination, a Wafer sheet supporting plate having spaced concavities, a die or stencil plate superimposed upon said plate and adapted thus to contact With the exposed surface of said water sheet, the openings in the die or stencil plate registering With said concavities and means for supplying filling through the opcnings of said die or stencil plate to the concavities of said water sheet.

6. Mechanism for forming filled Wafers con'iprising, in combination, Wafer sheet having spaced concaviti s, a die or stencil plate adapted to be superimposed upon said plate and dapted to contact With the eX- posed surface of the Water sheet thereon, a hopper for fi ling material, and means relatively to traverse the hopper and the supporting and stencil plates.

l. Mechanism for forming filled Wafers comprising, in combination, a Water sheet supporting plate having tWO joined members aoapt-ed to be superimposed one upon the othe a die or stencil plate adapted to be superimposed fiativise upon said plate and adapted to contact with the Water sheets thereon, said die or stencil plate being mounted for movement from active position, and hopper means for applying filling material through the openings of said stencil plate to the Water sheets.

8. Mechanism for forming filled Wafers comprising in combination, a Water sheet supporting plate composed of a plurality of sections adapted to be brought into face to face relation, and a die or stencil plate adapted to be superimposed fiatwise upon said supporting plate and having filling receiving openlngs.

9. Mechanism for forming filled Wafers comprising in combination, a Wafer sheet i supporting plate, a die or stencil plate adapted to be applied to the supporting plate and having therein a plurality of spaced openings, the portions or" the die or stencil plate about said openings being adapted to shield portions of the Wafer sheet supporting plate, and means to supply filling through the said openings of the die or stencil plate to spaced areas of said sup porting plate.

10. dechanism for forming filled Wafers comprising in combination, a Wafer sheet supporting plate having a series of spaced concavities, and a die or stencil plate superimposed thereon for permitting the application to said concavities only of a predetermined measured quantity of filling slightly exceeding the capacity of said concavities, said die or stencil plate having a series of spaced openings adapted to register With said concavities, whereby said die or stencil plate shields a Water sheet supporting plate except at the spaced concavities therehf.

11. lvlechanism for forming filled Wafers comprising in combination, a Wafer supporting mold plate having spaced concavities, a die or stencil plate adapted to be superimposed fiatwise thereagainst and adapted to contact With the exposed surface of the Wafer sheet upon said plate, said stencil plate being hinged, thereby to permit it to be swung away from said wafer sheet, and means for supplying filling through the die or stencil plate to the wafer sheet upon the supporting mold plate.

12. Mechanism for forming filled wafers comprising in combination, a wafer sheet receiving mold plate composed of a plurality of relatively movable sections for effecting superposition of wafer sheets supported thereon, and a die or stencil plate mounted to contact with the upper face of the sheet upon said mold plate.

13. Mechanism for forming filled wafers comprising in combination, a wafer sheet receiving mold plate having a plurality of spaced concavities and a die or stencil plate pivoted in substantially the plane of the upper face of the mold plate and having openings adapted to register with said concavities.

14. Mechanism for forming filled wafers comprising, in combination, a wafer sheet receiving, two member, mold plate said members being relatively movable and a stencil plate mounted to contact with the up per surface of the sheet upon said mold plate.

15. Mechanism for forming filled wafers comprising, in combination, a two-member, wafer sheet receiving mold plate, said members being relatively movable and a stencil plate pivoted in substantially the plane of the upper face of said mold plate.

16. Mechanism for forming filled wafers comprising in' combination, a two member, wafer sheet receiving mold plate, said members being relatively movable and a stencil plat mounted to contact with the upper surface of the sheet upon said mold plate,

' and a hopper movable to and fro along the upper face of the stencil plate.

17. Mechanism for forming filled wafers comprising, in combination, a two member, wafer sheet receiving mold plate, said members being relatively movable and a stencil plate pivoted in substantially the plane of the upper face of said mold plates, and a hopper movable to and fro along the upper face of the stencil plate,

18. Mechanism for forming filled wafers comprising, in combination, two member, wafer sheet receiving mold plate, said members being relatively movable and a stencil plate mounted to contact with the upper surface of the sheet upon said mold plate,

a hopper and means to impart relative to and fro movement to said hopper and the stencil and mold plates.

19. Mechanism for forming filled Wafers comprising,'in combination, a two-member, wafer sheet receiving mold plate, said members being relatively movable and a stencil plate pivoted in substantially the plane of the upper face of said mold plate, a hopper,

and means to impart relative to and fro movement to said hopper and the stencil and mold plates;

20. Mechanism for forming fillet wafers comprising, in combination, a wafer sheet supporting mold plate composed of two th upper face of said mold plate, a hopper,

and rack and pinion means to reciprocate the hopper along the face of. the stencil plate.

comprising, in combination, a wafer sheet receiving mold: plate composed of two members movable into superposition, and a hinged stencil or die plate mounted in substantially the plane of the upper face of the mold plate.

23. Mechanism for forming filled wafers comprising in combination, a two part, hinged, wafer sheet receiving mold plate and a stencil plate hinged at right angles to the hinge of said mold plate.

24-. Mechanism for forming filled wafers comprising in combination, a wafer supporting plate having a pair of members shaped to receive matching wafer sheets, said members being relatively movable so as to bring the wafer sheets thereon into superposition, a die or stencil plate adapted to be superimposed upon said wafer supporting plate, and having av plurality of openings through which filling material may be applied to at least one of said wafer sheets and whereby the remaining portion 22. Mechanism for forming filled wafers of said Wafer sheet is shielded by the sursuperimposed flatwise upon said wafer sheet supporting plate and adapted to contact with the wafer sheets thereon, said die or stencilplate being mounted for movement from active position, and hopper means for applying filling material through the openings of said stencil plate to the wafer sheets at said concavities.

26. Mechanism for forming filled wafers comprising in combination, awafer sheet supporting plate having two joined members adapted to be superimposed one upon the other, a die or stencil plate pivoted in operative relation to said Water sheet supporting plate and adapted to be superimposed fiat- Wise thereon and to contact With the Wafer sheets thereon, and hop er means for applying filling material through the openings of said stencil plate to the Wafer sheets.

i. Mechanism "for forming filled Waters comprising in combination, a Wafer sheet supporting plate formed in sections hinged together, said sections having spaced conca ities, and a die or stencil plate adapted to be superim iosed flatwise upon said supporting plate and having filling receiving openings adapted to register With said spaced concavities.

28, Mechanism for forming filled Wafers comprising in combination, a Wafer sheet supporting plate, and a die or stencil plate adapted to be applied to the supporting plate and having therein a plurality oi spaced openings, the portions of the die or stencil plate about said openings being adapted to shield portions of the Wafer sheet supp rting plate.

:39. Mechanism for forming filled Wafers comprising in combination, a Wafer sheet supporting plate, a die or stencil plate adapted to be applied to the supporting plate and having therein a plurality of spaced openings, the portions of the die or stencil plate about said openings being adapted to shield portions of the Wafer sheet supporting plate, and means to supply filling by a wiping action through the said openings of the die or stencil plate to spaced areas of said supporting plate.

30. Mechanism for forming filled Wafers comprising in combination, two water sheet supporting plates, means to superpose one of said plates With its supported Wafer sheet upon the other, and two die or stencil plates adapted to be applied to the supporting plate prior to said superposition, and

each having therein a plurality of spaced openings, the portions of the die or stencil plates about said openings being adapted to shield portions of the Wafer sheet supporting plates, and means to supply filling tirough said openings of the die or stencil EDlVARD E. LA'WRENCE.

Witnesses:

WILLIAM W. CLARK, THnoDoR B. Gooon.

GGpiES Of this 119.13511'5 K112. b5 obtained f0]: five CEIiIuS each h addressing the uomniissioner Of Patents a W ashington, D. G. 

